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Quantité | Prix (hors TVA) |
---|---|
1+ | 5,790 € |
10+ | 5,400 € |
25+ | 5,160 € |
50+ | 5,020 € |
100+ | 4,870 € |
250+ | 4,730 € |
500+ | 4,640 € |
Informations produit
Aperçu du produit
AS4C64M16D3LC-12BIN is a 64M x 16bit DDR3L synchronous DRAM (SDRAM). The 1Gb double-data-rate-3L (DDR3L) DRAMs is a double data rate architecture to achieve high-speed operation. It is internally configured as an eight-bank DRAM. The 1Gb chip is organized as 8Mbit x 16 I/Os x 8 bank devices. It achieves high-speed double-data-rate transfer rates of up to 1600Mb/sec/pin for general applications. The chip is designed to comply with all DDR3L DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pairs in a source-synchronous fashion.
- JEDEC standard compliant, supports JEDEC clock jitter specification
- Fully synchronous operation, fast clock rate: 800MHz, differential clock, CK and CK#
- Bidirectional differential data strobe, DQS and DQS#, 8 internal banks for concurrent operation
- 8n-bit prefetch architecture, pipelined internal architecture, precharge and active power down
- Programmable mode and extended mode registers, additive latency (AL): 0, CL-1, CL-2
- Programmable burst lengths: 4, 8, burst type: sequential/interleave, output driver impedance control
- Auto refresh and self refresh, write levelling
- ZQ calibration, dynamic ODT (Rtt-Nom and Rtt-WR)
- 96-ball FBGA package
- Industrial temperature range from -40°C to 95°C
Spécifications techniques
DDR3
64M x 16bits
FBGA
1.35V
-40°C
-
1Gbit
800MHz
96Broche(s)
Montage en surface
95°C
No SVHC (27-Jun-2024)
Documents techniques (1)
Législation et Questions environnementales
Pays dans lequel la dernière étape de production majeure est intervenuePays d'origine :Taiwan
Pays dans lequel la dernière étape de production majeure est intervenue
RoHS
RoHS
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